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 ICX055BK
Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras
Description The ICX055BK is an interline CCD solid-state image sensor suitable for PAL color video cameras. Compared with the current product ICX055AK, sensitivity is improved drastically through the adoption of Super HAD CCD technology. Ye, Cy, Mg, and G complementary color mosaic filters are used. This chip features a field period readout system, and an electronic shutter with variable charge-storage time. 16 pin DIP (Plastic)
Pin 1
Features * High sensitivity (+3dB at F5.6, +1.5dB at F1.2 compared with ICX055AK) * High saturation signal (+1dB compared with ICX055AK) V * Low smear and low dark current * Excellent antiblooming characteristics * Continuous variable-speed shutter 7 30 H Pin 9 * Ye, Cy, Mg and G complementary color mosaic filters on chip * Horizontal register: 5V drive Optical black position * Reset gate: 5V drive (Top View) Device Structure * Interline CCD image sensor * Image size: Diagonal 6mm (Type 1/3) * Number of effective pixels: 500 (H) x 582 (V) approx. 290K pixels * Number of total pixels: 537 (H) x 597 (V) approx. 320K pixels * Chip size: 6.00mm (H) x 4.96mm (V) * Unit cell size: 9.8m (H) x 6.3m (V) * Optical black: Horizontal (H) direction: Front 7 pixels, Rear 30 pixels Vertical (V) direction: Front 14 pixels, Rear 1 pixel * Number of dummy bits: Horizontal 16 Vertical 1 (even field only) * Substrate material: Silicon
1
14
Super HAD CCD is a registered trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing newly
developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E98224A99
ICX055BK
VOUT
VGG
VSS
GND
V2
8
7
6
5
V1
V3
4
3
2
Cy
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Vertical register
Mg Cy G Cy Mg
Note
Horizontal register Note) 9 10 11 12 13 14 15 16 : Photo sensor
VL
GND
SUB
Pin Description Pin No. 1 2 3 4 5 6 7 8 Symbol V4 V3 V2 V1 GND VGG VSS VOUT Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock GND Output amplifier gate bias Output amplifier source Signal output Pin No. 9 10 11 12 13 14 15 16 Symbol VDD GND SUB VL RG NC H1 H2 Horizontal register transfer clock Horizontal register transfer clock Description Output amplifier drain supply GND Substrate (Overflow drain) Protective transistor bias Reset gate clock
Absolute Maximum Ratings Item Substrate voltage SUB - GND Supply voltage VDD, VOUT, VSS - GND VDD, VOUT, VSS - SUB V1, V2, V3, V4 - GND V1, V2, V3, V4 - SUB Ratings -0.3 to +55 -0.3 to +18 -55 to +10 -15 to +20 to +10 to +15 to +17 -17 to +17 -10 to +15 -55 to +10 -65 to +0.3 -0.3 to +30 -0.3 to +24 -0.3 to +20 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V V V C C 1 Remarks
Vertical clock input voltage
Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins H1, H2 - V4 H1, H2, RG, VGG - GND H1, H2, RG, VGG - SUB VL - SUB V1, V2, V3, V4, VDD, VOUT - VL RG - VL VGG, Vss, H1, H2 - VL Storage temperature Operating temperature *1 +27V (Max.) when clock width<10s, clock duty factor<0.1%. -2-
VDD
H1
H2
RG
NC
V4
1
Block Diagram and Pin Configuration (Top View)
ICX055BK
Bias Conditions Item Output amplifier drain voltage Output amplifier gate voltage Output amplifier source Substrate voltage adjustment range Fluctuation range after substrate voltage adjustment Reset gate clock voltage adjustment range Fluctuation range after reset gate clock voltage adjustment Protective transistor bias DC Characteristics Item Output amplifier drain current Input current Input current Symbol IDD IIN1 IIN2 Min. Typ. 3 1 10 Max. Unit mA A A 3 4 Remarks Symbol VDD VGG VSS VSUB VSUB VRGL VRGL VL Min. 14.55 1.75 Typ. 15.0 2.0 Max. 15.45 2.25 Unit V V 5% V % V % 1 1 Remarks
Grounded with 680 resistor 9.0 -3 1.0 -3 2 18.5 +3 4.0 +3
1 Indications of substrate voltage (VSUB) * reset gate clock voltage (VRGL) setting value. The setting values of substrate voltage and reset gate clock voltage are indicated on the back of the image sensor by a special code. Adjust substrate voltage (VSUB) and reset gate clock voltage (VRGL) to the indicated voltage. Fluctuation range after adjustment is 3%. VSUB code VRGL code one character indication one character indication VRGL code VSUB code Code and optimal setting correspond to each other as follows. VRGL code Optimal setting VSUB code Optimal setting 1 2 3 4 5 6 7
1.0 1.5 2.0 2.5 3.0 3.5 4.0 E f G h J K L m N P Q R S T U V W X Y Z
9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5
"5L" VRGL = 3.0V VSUB = 12.0V 2 VL setting is the VVL voltage of the vertical transfer clock waveform. 3 1) Current to each pin when 18V is applied to VDD, VOUT, Vss and SUB pins, while pins that are not tested are grounded. 2) Current to each pin when 20V is applied sequentially to V1, V2, V3 and V4 pins, while pins that are not tested are grounded. However, 20V is applied to SUB pin. 3) Current to each pin when 15V is applied sequentially to RG, H1, H2 and VGG pins, while pins that are not tested are grounded. However, 15V is applied to SUB pin. 4) Current to VL pin when 30V is applied to V1, V2, V3, V4, VDD and VOUT pins or when, 24V is applied to RG pin or when, 20V is applied to VGG, Vss, H1 and H2 pins, while VL pin is grounded. However, GND and SUB pins are left open. 4 Current to SUB pin when 55V is applied to SUB pin, while pins that are not tested are grounded. -3-
ICX055BK
Clock Voltage Conditions Item Readout clock voltage Symbol VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2, VVL3, VVL4 VV Vertical transfer clock voltage |VVH1 - VVH2| VVH3 - VVH VVH4 - VVH VVHH VVHL VVLH VVLL Horizontal transfer clock voltage Reset gate clock voltage VH VHL VRG VRGLH - VRGLL 22.5 23.5 4.75 -0.05 4.5 5.0 0 5.0 -0.25 -0.25 Min. 14.55 -0.05 -0.2 -9.0 7.8 Typ. 15.0 0 0 -8.5 8.5 Max. 15.45 0.05 0.05 -8.0 9.05 0.1 0.1 0.1 0.5 0.5 0.5 0.5 5.25 0.05 5.5 0.8 24.5 Unit V V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 2 2 3 3 4 4 5 1 Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL3 + VVL4) /2 VV = VVHn - VVLn (n = 1 to 4) VVH = (VVH1 + VVH2) /2 Remarks
Substrate clock voltage VSUB
1 The reset gate clock voltage need not be adjusted when reset gate clock is driven when the specifications are as given below. In this case, the reset gate clock voltage setting indicated on the back of the image sensor has not significance.
Item Reset gate clock voltage
Symbol VRGL VRG
Min. -0.2 8.5
Typ. 0 9.0
Max. 0.2 9.5
Unit V V
Waveform diagram 4 4
Remarks
-4-
ICX055BK
Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Symbol CV1, CV3 CV2, CV4 CV12, CV34 Capacitance between vertical transfer clocks CV23, CV41 CV13 CV24 Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor
V1
Min.
Typ. 1500 820 470 230 150 230 47 47 5 320 51 100 15 10 40
Max.
Unit pF pF pF pF pF pF pF pF pF pF
Remarks
CH1, CH2 CHH CRG CSUB R1, R3 R2, R4 RGND RH RRG
V2
R1
CV12
R2 RH H1 RH H2 CHH CV23 CV13 CH1 CH2
CV1 CV41 CV24
CV2
CV4 RGND CV3 R4 CV34 R3
V4
V3
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
RRG RG
CRG
Reset gate clock equivalent circuit -5-
ICX055BK
Drive Clock Waveform Conditions (1) Readout clock waveform
100% 90%
II II
M VVT 10% 0% tr twh tf 0V M 2
(2) Vertical transfer clock waveform
V1 VVHH V3 VVHH VVHH VVHL VVHL VVH3 VVHH
VVH1
VVH VVHL
VVH
VVHL
VVL1
VVLH
VVL3
VVLH VVLL VVL
VVLL VVL
V2 VVHH VVHH
V4 VVH VVHH VVHH
VVH VVHL
VVH2 VVHL
VVHL VVH4
VVHL
VVL2
VVLH
VVLH
VVLL VVL VVL4
VVLL VVL
VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) -6-
ICX055BK
(3) Horizontal transfer clock waveform
tr
twh
tf
90%
VH 10% VHL
twl
(4) Reset gate clock waveform
tr twh tf VRGH twl
Point A RG waveform VRGLH VRGL VRGLL VRG VRGL + 0.5V
H1 waveform 10%
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL
-7-
ICX055BK
(5) Substrate clock waveform
100% 90%
M VSUB 10% 0% M 2 tf
VSUB
tr
twh
Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock Horizontal transfer clock Horizontal transfer clock Reset gate clock Substrate clock Symbol VT V1, V2, V3, V4 H H1 H2 RG SUB 11 15 75 37 41 5.6 5.6 79 38 42 12 0.012 0.012 6.5 0.5 15 twh twl tr tf Unit Remarks s During readout
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 0.015 2 10 0.012 0.012 4.5 0.5 0.5
0.25 s 1 15 ns During imaging
s During parallelserial s conversion ns s During drain charge
1.5 2.0
1 When vertical transfer clock driver CXD1267AN is used. 2 tf tr - 2ns.
-8-
ICX055BK
Image Sensor Characteristics Item Sensitivity Saturation signal Smear Video signal shading Uniformity between video signal channels Dark signal Dark signal shading Flicker Y Flicker R-Y Flicker B-Y Line crawl R Line crawl G Line crawl B Line crawl W Lag Symbol S Ysat Sm SHy Sr Sb Ydt Ydt Fy Fcr Fcb Lcr Lcg Lcb Lcw Lag Min. 780 720 0.002 0.007 20 25 10 10 2 1 2 5 5 3 3 3 3 0.5 Typ. 940 Max. Unit mV mV % % % % % mV mV % % % % % % % % Measurement method 1 2 3 4 4 5 5 6 7 8 8 8 9 9 9 9 10
(Ta = 25C) Remarks
Ta = 60C
Zone 0, I Zone 0 to II'
Ta = 60C Ta = 60C
Zone Definition of Video Signal Shading
500 (H) 9 6 9 H 8 V 10 H 8
582 (V)
Zone 0, I Zone II, II' V 10
8
Ignored region Effective pixel region
Measurement System
[A] CCD signal output CCD C.D.S AMP S/H LPF2 S/H (3dB down 1MHz) [C] Chroma signal output [Y] LPF1 (3dB down 4MHz) Y signal output
Note) Adjust the amplifier gain so that the gain between [A] and [Y] and between [A] and [C] equal 1. -9-
ICX055BK
Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the substrate voltage and the reset gate clock voltage are set to the values indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output or chroma signal output of the measurement system. Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals
Cy G B Cy Mg Ye G Cy Mg Ye A2 G Ye Mg Cy G Ye A1 Mg
As shown in the left figure, fields are read out. The charge is mixed by pairs such as A1 and A2 in the A field. (pairs such as B in the B field) As a result, the sequence of charges output as signals from the horizontal shift register (Hreg) is, for line A1, (G + Cy), (Mg + Ye), (G + Cy), and (Mg + Ye).
Hreg
Color Coding Diagram These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words, the approximation: Y = {(G + Cy) + (Mg + Ye)} x 1/2 = 1/2 {2B + 3G + 2R} is used for the Y signal, and the approximation: R - Y = {(Mg + Ye) - (G + Cy)} = {2R - G} is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are (Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye). The Y signal is formed from these signals as follows: Y = {(G + Ye) + (Mg + Cy)} x 1/2 = 1/2 {2B + 3G + 2R} This is balanced since it is formed in the same way as for line A1. In a like manner, the chroma (color difference) signal is approximated as follows: - (B - Y) = {(G + Ye) - (Mg + Cy)} = - {2B - G} In other words, the chroma signal can be retrieved according to the sequence of lines from R - Y and - (B - Y) in alternation. This is also true for the B field.
- 10 -
ICX055BK
Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following formula. S = Ys x 250 [mV] 50
2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with average value of the Y signal output, 200mV, measure the minimum value of the Y signal. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the Y signal output and substitute the value into the following formula. Sm = 1 YSm 1 x x x 100 [%] (1/10V method conversion value) 10 200 500
4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula. SHy = (Ymax - Ymin)/200 x 100 [%] 5. Uniformity between video signal channels Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin [mV]) values of the R - Y and B - Y channels of the chroma signal and substitute the values into the following formula. Sr = | (Crmax - Crmin)/200 | x 100 [%] Sb = | (Cbmax - Cbmin)/200 | x 100 [%] 6. Dark signal Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. - 11 -
ICX055BK
7. Dark signal shading After measuring 6, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal output and substitute the values into the following formula. Ydt = Ydmax - Ydmin [mV] 8. Flicker 1) Fy Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the difference in the signal level between fields (Yf [mV]). Then substitute the value into the following formula. Fy = (Yf/200) x 100 [%] 2) Fcr, Fcb Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, insert an R or B filter, and then measure both the difference in the signal level between fields of the chroma signal (Cr, Cb) as well as the average value of the chroma signal output (CAr, CAb). Substitute the values into the following formula. Fci = (Ci/CAi) x 100 [%] (i = r, b) 9. Line crawls Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference between Y signal lines for the same field (Ylw, Ylr, Ylg, Ylb [mV]). Substitute the values into the following formula. Lci = (Yli/200) x 100 [%] (i = w, r, g, b) 10. Lag Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following formula. Lag = (Ylag/200) x 100 [%]
FLD
SG1 Light Strobe light timing Y signal output 200mV Output Ylag (lag)
- 12 -
Drive Circuit
15V 100k 20 19 18 17 16 15 14 13 22/16V 27k 180k 680 47/6.3V 12 1/35V 0.1 -8.5V 3.3/16V 0.1 0.1
1
5V VSUB
0.1
2 3
XSUB
4
XV2
5
XV1
6
CXD1267AN
XSG1
7
8
XV3
9
XSG2 11
V3
V4
V2
V1
VGG
VSS
GND
VOUT
H1
NC
GND
H2
H2
16 15 14 13 12 11 10
RG
VL
SUB
9 1500p 0.01 3.3/20V 1M
H1
2SA1175 100k 10k 10/16V
47k
0.1
0.01 ICX055BK
RG
VDD
- 13 -
1 2 3 45 ICX055 (BOTTOM VIEW)
22/20V 67 8 100 2SK523 3.9k [A] CCD OUT
1/6.3V
XV4
10
ICX055BK
Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics)
1.0 0.9 0.8 0.7
Ye
G Cy
Relative Response
0.6 0.5 0.4 0.3 0.2 0.1 0.0 400 450 500 550 Wave Length [nm] 600 650 700 Mg
Sensor Readout Clock Timing Chart
HD
V1 V2 Odd Field V3 V4 38.5 1.2 1.5 2.5 2.0 2.5
0.3 V1 V2 Even Field V3 V4 Unit: s
- 14 -
Drive Timing Chart (Vertical sync)
FLD VD
BLK
HD
10 15 20 25 320 315 330 310 325 335 340
SG1
SG2
V1
V2
V3
V4
246 135 24 6 135
620
625 1 2 3 4 5
- 15 -
582 581
24 68 1357 2468 1357
CCD OUT
582 581
ICX055BK
Drive Timing Chart (Horizontal sync)
HD
BLK
H1
1 2 3 5 20 25 30 10 15 16 1 2 3 5 7 1 2 3 5
5
490
RG
- 16 -
XSHP
XSHD
V1
V2
V3
V4
SUB
495
500 1 2 3
10
15
H2
ICX055BK
ICX055BK
Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.)
Cover glass
50N Plastic package Compressive strength
50N
1.2Nm Torsional strength
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. - 17 -
ICX055BK
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics.
- 18 -
Package Outline
Unit: mm
16pin DIP (450mil)
A
0 to 9
6.1 9 16
D
~
2.5
C
11.43
8.4
5.7
V 2-R0.5
~
2.5
H
9.5 11.4 0.1
0.5
B'
3.1
0.3
M
1.27 3.5 0.3
- 19 -
1.2
2.5 1. "A" is the center of the effective image area.
3.35 0.15
9.2
~
2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (6.1, 5.7) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 50m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 50m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing.
ICX055BK
0.69 1.27 0.46
0.3
(For the first pin only)
PACKAGE STRUCTURE
PACKAGE MATERIAL
Plastic
LEAD TREATMENT
GOLD PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
0.9g
0.25
1.2 11.6
10.3 12.2 0.1
8 1
2.5
B


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